Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-06-30
1997-02-04
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566371, 156345, 216 88, 437225, H01L 2100
Patent
active
055994237
ABSTRACT:
Apparatus and concomitant method for simulating a chemical mechanical polishing (CMP) system containing a polishing pad, a chuck for supporting a substrate, a positioner for positioning the polishing pad with respect to the substrate, a chuck rotator for rotating the chuck, and a polishing pad rotator for rotating the polishing pad. The CMP system simulation method comprises: defining polishing pad and substrate parameters; defining simulation parameters; determining, in response to said polishing pad, substrate and simulation parameters, a polishing result; and displaying the polishing result. Additionally, the simulation optimizes selected parameters to achieve a specified polishing non-uniformity across a substrate. Also, the simulation and optimization routines are interfaced to CMP system hardware to optimally control a substrate polishing process to achieve predetermined substrate polishing non-uniformity.
REFERENCES:
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4940507 (1990-07-01), Harbarger
patent: 5474644 (1995-12-01), Kato et al.
patent: 5514245 (1996-05-01), Doan et al.
Lee Harry Q.
Parker Norman W.
Tolles Robert D.
Applied Materials Inc.
Powell William
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