Apparatus and method for positioning semiconductor substrate

Material or article handling – Article reorienting device – Article reoriented while fully supported by stationary...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C414S936000, C414S816000

Reexamination Certificate

active

07458762

ABSTRACT:
The disclosure is a baking apparatus including a susceptor, lift pins, and guiding blocks positioned at the edge of the susceptor to lead a wafer to be exactly positioned on the susceptor. The guiding blocks are linearly movable within a range of a semidiameter of a plate. A wafer is partially mounted on a wafer guide, being inclined against the susceptor, and thereby may heats uniformly.

REFERENCES:
patent: RE30601 (1981-05-01), Horr et al.
patent: 5000652 (1991-03-01), Christensen et al.
patent: 5421056 (1995-06-01), Tateyama et al.
patent: 5762391 (1998-06-01), Sumnitsch
patent: 6168427 (2001-01-01), Cho et al.
patent: 6202528 (2001-03-01), Morgan
patent: 6393337 (2002-05-01), Perlov et al.
patent: 6601313 (2003-08-01), Shin et al.
patent: 6612589 (2003-09-01), Saito
patent: 6932558 (2005-08-01), Wu
patent: 7226055 (2007-06-01), Bettencourt et al.
patent: 2003/0219333 (2003-11-01), Takeuchi
patent: 2003-0012479 (2003-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for positioning semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for positioning semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for positioning semiconductor substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4032642

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.