Apparatus and method for measuring the thickness of a semiconduc

Details Apparatus and method for measuring the thickness of a semiconduc Apparatus and method for measuring the thickness of a semiconduc

1993-02-08

1995-03-07

Hille, Rolf

Optics: measuring and testing

By configuration comparison

With photosensitive film or plate

356381, 250571, G01B 1106

Patent

active

053963326

ABSTRACT:
Apparatus for measuring thicknesses of semiconductor wafers, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light.

REFERENCES:
patent: 2951416 (1960-09-01), Shinn
patent: 3732016 (1973-05-01), Deshayes et al.
patent: 4166700 (1979-09-01), Bowen et al.
patent: 4623254 (1986-11-01), Imose
patent: 4732473 (1988-03-01), Bille et al.
patent: 4878755 (1989-11-01), Siegmund et al.
patent: 4914307 (1990-04-01), Kanev
patent: 5054317 (1991-10-01), Loubscher
patent: 5120966 (1992-06-01), Kondo
patent: 5130556 (1992-07-01), Duncan et al.
patent: 5177564 (1993-01-01), Kato et al.

Affiliated with

Also associated with

Rating

Apparatus and method for measuring the thickness of a semiconduc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for measuring the thickness of a semiconduc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for measuring the thickness of a semiconduc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1410451