Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Patent
1998-09-14
2000-03-14
Lund, Jeffrie R
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
438908, 438909, 438935, 4272481, 4272557, 29 2501, H01L 2100, C23C 1600
Patent
active
060372729
ABSTRACT:
An apparatus for low pressure chemical vapor deposition for fabricating a semiconductor device comprises a group of reaction chambers, a group of high-vacuum pumps connected to the reaction chambers, a group of gate valves connected to the high-vacuum pumps, and a low-vacuum pump connected to the gate valves. There are fewer gate valves than high-vacuum pumps. A method for fabricating a semiconductor device using the above apparatus includes the sequence and duration of opening gate valves, injecting reaction gases, and pumping with the low vacuum pump. According to the present invention, since the number of pumps is reduced, the cost for installation, operation and maintenance of the semiconductor device fabrication apparatus is reduced.
REFERENCES:
patent: 4442338 (1984-04-01), Yamazaki
patent: 4592306 (1986-06-01), Gallego
patent: 4636401 (1987-01-01), Yamazaki et al.
patent: 4655800 (1987-04-01), Tsukada et al.
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4725204 (1988-02-01), Powell
patent: 4824545 (1989-04-01), Arnold et al.
patent: 4867859 (1989-09-01), Harada et al.
patent: 4895107 (1990-01-01), Yano et al.
patent: 4975168 (1990-12-01), Ohno et al.
patent: 5039280 (1991-08-01), Saulgeot et al.
patent: 5076205 (1991-12-01), Vowles et al.
patent: 5183511 (1993-02-01), Yamazaki et al.
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5286296 (1994-02-01), Sato et al.
patent: 5288329 (1994-02-01), Nakamura et al.
patent: 5609689 (1997-03-01), Kato et al.
patent: 5695564 (1997-12-01), Imahashi
patent: 5863842 (1999-01-01), Ohmi
patent: 5873942 (1999-02-01), Park et al.
Kim Jung Ki
Kim Young Sun
Park Jun Sig
Lund Jeffrie R
Samsung Electronics Co,. Ltd.
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