Apparatus and method for examining wafers

Details Apparatus and method for examining wafers Apparatus and method for examining wafers

1996-12-18

2000-08-29

Lund, Jeffrie R.

Optics: measuring and testing

Inspection of flaws or impurities

382149, 348126, 25055941, 41433118, 414331, 414757, 414935, 414936, 414937, 414940, 3241581, G01N 2100, H04N 718, B65G 4907

Patent

active

061116378

ABSTRACT:
A method and an apparatus for examining wafers includes a wafer cassette having a capacity for holding a plurality of wafers located on each of first and second locaters. The wafer cassettes are fixedly held on the first and second locaters during the wafer examination. A first indicator shows that the wafer cassettes are fixedly held on the first and second locaters. A robot arm sequentially carries each of the wafers between the first locator, an aligner, a scanning chamber and the second locater to examine the wafers. The wafer cassettes are released when the examination is complete, and a second indicator shows that the examination is complete.

REFERENCES:
patent: 4644172 (1987-02-01), Sandland et al.
patent: 4818169 (1989-04-01), Schram et al.
patent: 4938654 (1990-07-01), Schram
patent: 5105147 (1992-04-01), Karasikov et al.
patent: 5488292 (1996-01-01), Tsuta

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