Apparatus and method for enhancing uniformity of a metal film fo

Details Apparatus and method for enhancing uniformity of a metal film fo Apparatus and method for enhancing uniformity of a metal film fo

1997-09-03

1999-05-11

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429806, 20429808, 20429816, C23C14/34

Patent

active

059024615

ABSTRACT:
An apparatus and method for sputtering ionized material onto a substrate with the aid of an inductively coupled plasma which ionizes the material, which apparatus includes: a support member having a support surface for supporting a substrate; a target constituting a source of sputtering material; a coil for generating a plasma which is inductively coupled to the coil and which ionizes material sputtered from the target; and components for piacing the support member at a potential which causes ionized material to be attracted to the support member. Magnets are provided to generate a magnetic field which is defined by magnetic field lines that lie in planes substantially perpendicular to the support surface and which have a constant polarity around the support surface.

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