Apparatus and method for distribution of slurry in a chemical me

Details Apparatus and method for distribution of slurry in a chemical me Apparatus and method for distribution of slurry in a chemical me

1997-12-02

2000-04-18

Breneman, Bruce

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438691, 438693, 216 89, B24B 100

Patent

active

06051499&

ABSTRACT:
Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.

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