Semiconductor device manufacturing: process – With measuring or testing
Patent
1995-06-07
1997-08-05
Niebling, John
Semiconductor device manufacturing: process
With measuring or testing
356335, 73 2801, 738655, 438 16, H01L 2166, G01N 3700, G01N 1500, G01B 1502
Patent
active
056542054
ABSTRACT:
An apparatus for depositing particles onto a wafer comprises a particle generating means; particle size controlling means connected to an output terminal of the particle generating means; a first transmitting tube connected to an output of the particle size controlling means; second and a third transmitting means connected to an output terminal of the first transmitting tube; first counting means connected to an output terminal of the second transmitting tube; particle depositing means connected to an output terminal of the third transmitting means; second counting means connected to the particle depositing means; and a power supplier connected to the particle depositing means. The apparatus and a method for depositing the particles onto the wafer provide a wafer on which particles of known size and kind are deposited. Also, the particles of a different kind and size are deposited on the same wafer.
REFERENCES:
patent: 5231865 (1993-08-01), McDermott et al.
patent: 5278626 (1994-01-01), Poole et al.
patent: 5374396 (1994-12-01), Blackford et al.
Ahn Byung-seol
Chae Seung-ki
Hahm Sang-kyu
Kim Jong-soo
Dutton Brian K.
Niebling John
Samsung Electronics Co,. Ltd.
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