Apparatus and method for controlling fluid material...

Details Apparatus and method for controlling fluid material... Apparatus and method for controlling fluid material...

2007-01-23

2007-01-23

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S041000, C451S056000, C451S287000, C451S443000, C451S444000

Reexamination Certificate

active

10741933

ABSTRACT:
An apparatus for use in a chemical mechanical planarization system is provided. The apparatus includes a fluid displacing device and a fluid delivery device. The fluid displacing device is capable of being positioned at a proximate location over a polishing pad, the fluid displacing device configured to displace at least part of a first fluid from a region of the polishing pad. The fluid delivery device is capable of replacing the displaced first fluid with a second fluid at the region of the polishing pad, the second fluid being different than the first fluid. A method of controlling properties of a film present over a polishing pad surface is also provided.

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patent: 2002-273651 (2002-09-01), None
patent: 2002273651 (2002-09-01), None
IBM Technical Disclosure Bulletin, Mar. 1994, US “Water/Air Brush for Wafer Chem-Mech Polishing”.

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