Antireflective structure and method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C438S769000, C438S952000

Reexamination Certificate

active

06930028

ABSTRACT:
The present invention provides integrated circuit fabrication with a silicon oxynitride antireflective layer for gate location plus patterned photoresist linewidth reduction for gate length definition followed by interconnect definition without patterned photoresist linewidth reduction. This has the advantages of an antireflective layer compatible with linewidth reduction and polysilicon etching.

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