Antireflective coatings for via fill and photolithography...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C106S287100, C106S287110, C106S287130

Reexamination Certificate

active

08053159

ABSTRACT:
An absorbing composition is described herein that includes at least one inorganic-based compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film.

REFERENCES:
patent: 31987 (1861-04-01), Nozaki et al.
patent: 58929 (1866-10-01), Adams et al.
patent: 106376 (1870-08-01), Kennedy et al.
patent: 172896 (1876-02-01), Adams et al.
patent: 3884702 (1975-05-01), Koshimo et al.
patent: 4191571 (1980-03-01), Nonogaki et al.
patent: 4299938 (1981-11-01), Green et al.
patent: 4413052 (1983-11-01), Green et al.
patent: 4430153 (1984-02-01), Gleason et al.
patent: 4587138 (1986-05-01), Yau et al.
patent: 4863827 (1989-09-01), Jain et al.
patent: 4863829 (1989-09-01), Furuta et al.
patent: 4910122 (1990-03-01), Arnold et al.
patent: 4935583 (1990-06-01), Kyle
patent: 4943511 (1990-07-01), Lazarus et al.
patent: 4950583 (1990-08-01), Brewer et al.
patent: 5100503 (1992-03-01), Allman et al.
patent: 5126289 (1992-06-01), Ziger
patent: 5152834 (1992-10-01), Allman
patent: 5302849 (1994-04-01), Cavasin
patent: 5403680 (1995-04-01), Otagawa et al.
patent: 5674648 (1997-10-01), Brewer et al.
patent: 5693691 (1997-12-01), Flaim et al.
patent: 5759625 (1998-06-01), Laubacher et al.
patent: 5851730 (1998-12-01), Thackeray et al.
patent: 5851738 (1998-12-01), Thackeray et al.
patent: 6040053 (2000-03-01), Scholz et al.
patent: 6165697 (2000-12-01), Thackeray et al.
patent: 6268108 (2001-07-01), Iguchi et al.
patent: 6268457 (2001-07-01), Kennedy et al.
patent: 6280911 (2001-08-01), Trefonas, III
patent: 6313257 (2001-11-01), Abbey
patent: 6365765 (2002-04-01), Baldwin et al.
patent: 6368400 (2002-04-01), Baldwin et al.
patent: 6399269 (2002-06-01), Mizutani et al.
patent: 6451503 (2002-09-01), Thackeray et al.
patent: 6472128 (2002-10-01), Thackeray et al.
patent: 6506497 (2003-01-01), Kennedy et al.
patent: 6528235 (2003-03-01), Thackeray et al.
patent: 6605362 (2003-08-01), Baldwin et al.
patent: 6677392 (2004-01-01), Ravichandran et al.
patent: 6740685 (2004-05-01), Li et al.
patent: 6908722 (2005-06-01), Ebata et al.
patent: 6956097 (2005-10-01), Kennedy et al.
patent: 7012125 (2006-03-01), Kennedy et al.
patent: 7014982 (2006-03-01), Thackeray et al.
patent: 2002/0068181 (2002-06-01), Baldwin et al.
patent: 2003/0091838 (2003-05-01), Hayashi et al.
patent: 2003/0199633 (2003-10-01), Leon et al.
patent: 2004/0122197 (2004-06-01), Putzer
patent: 2004/0166434 (2004-08-01), Dammel et al.
patent: 2006/0110682 (2006-05-01), Thackeray et al.
patent: 2006/0155594 (2006-07-01), Almeida et al.
patent: 2007/0272123 (2007-11-01), Kennedy et al.
patent: 2009/0029145 (2009-01-01), Thies et al.
patent: 0494744 (1992-07-01), None
patent: 59109565 (1984-06-01), None
patent: 6056560 (1994-03-01), None
patent: 6095385 (1994-04-01), None
patent: 9183853 (1997-07-01), None
patent: 10502461 (1998-03-01), None
patent: 10161315 (1998-06-01), None
patent: 2001-92122 (2001-04-01), None
patent: 2006-241407 (2006-09-01), None
patent: 0077575 (2000-12-01), None
patent: WO 02/06402 (2002-01-01), None
patent: 02/16477 (2002-02-01), None
patent: 03/044078 (2003-05-01), None
patent: 03/044600 (2003-05-01), None
patent: 03/070809 (2003-08-01), None
patent: 03/089992 (2003-10-01), None
patent: WO 03088343 (2003-10-01), None
patent: WO -03088344 (2003-10-01), None
patent: WO 03088344 (2003-10-01), None
U.S. Appl. No. 90/008,360, Shipley Company, L.L.C.
Brewer, T. et al., “The Reduction of the Standing Wave Effect in Positive Photoresists,” Jour. Appl. Photogr. Eng., vol. 7, No. 6, 184-186 (Dec. 1981).
Crivello et al., J. Polym. Sci.: Polym. Chem. 21 (1983), 97-109.
Degussa, “Silanes for Adhesives and Sealants,” 18-19, available at www.dynasylan.com.
Lamola, A. et al., “Chemically Amplified Resists,” Solid State Technology, 53-60 (Aug. 1991).
Y.-C. Lin et al., “Some Aspects of Anti-Reflective Coating for Optical Lithography,” Advances in Resist Technology and Processing, Proc., SPIE vol. 469, 30-37 (1984).
McKean et al., “Characterization of a Novolac-Based Three-Component Deep-UV Resist,” Chem. Mater. (1990) 2, 619-624.
Nalamasu et al., “Development of a Chemically Amplified Positive (CAMP) Resist Material for Single Layer Deep-UV Lithography,” Advances in Resist Technology and Processing VII, SPIE 1262, 32-41 (1990).
Silverstein et al., “Spectrometric Identification of Organic Compounds,” 4th Ed. John Wiley & Sons 1991, 309-311.
Willson, C.G., “Organic Resist Materials—Theory and Chemistry,” Introduction to Microlithography, American Chemical Society, 87-159 (1983).
Hawley's Condensed Chemical Dictionary, 11th ed., 85-86.
“HD Micro Puts Out Positive Polyamide,” Electronic News, Jun. 19, 2000.
Jaskol et al., Toxicological Sciences, 22(1): 103-112 (1994).
Yusuke Izumi, et al., “Hydrosilyation of Carbonyl Compounds Catalyzed by Solid Acids and Bases,” Tetrahedron Letters, vol. 32, No. 36, pp. 4744 (1991).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Antireflective coatings for via fill and photolithography... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Antireflective coatings for via fill and photolithography..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Antireflective coatings for via fill and photolithography... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4304606

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.