Angular spin, rinse, and dry module and methods for making...

Details Angular spin, rinse, and dry module and methods for making... Angular spin, rinse, and dry module and methods for making...

2006-04-18

2006-04-18

Stinson, Frankie L. (Department: 1746)

Cleaning and liquid contact with solids

Processes

With work or work parts movable during treatment

C134S034000, C134S037000

Reexamination Certificate

active

07029539

ABSTRACT:
A method for processing a wafer in a spin, rinse, and dry (SRD) module is provided. The method includes engaging a wafer in a process plane, spinning the wafer in the process plane, and cleaning a top surface and a bottom surface of the wafer while spinning the wafer in the process plane. The process plane is configured to define a process angle with a horizontal plane. The process angle is configured to optimize the performance of the SRD module.

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