Anchors for microelectromechanical systems having an SOI...

Details Anchors for microelectromechanical systems having an SOI... Anchors for microelectromechanical systems having an SOI...

2008-01-07

2009-08-25

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S118000, C438S127000, C438S612000

Reexamination Certificate

active

07579206

ABSTRACT:
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

REFERENCES:
patent: 6952041 (2005-10-01), Lutz et al.

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