Aluminum gates including ion implanted composite layers

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257348, 257349, 257350, 257351, 257352, 257353, 257529, 257530, 257532, 257538, H01L 21223

Patent

active

059693860

ABSTRACT:
An aluminum gate for a thin film transistor is fabricating by implanting ions into the exposed surface of the aluminum gate. The ions are preferably selected from the group consisting of nitrogen, carbon, oxygen and boron ions. A composite layer of aluminum and the implanted ions thereby formed at the exposed surface of the aluminum layer. Gates for thin film transistors, including an aluminum layer and a composite layer of aluminum and another element at the surface thereof can suppress hillocks in the aluminum gate which may be caused by compressive stresses during subsequent fabrication steps. The composite layer can have a low resistance and can allow a direct contact with an indium tin oxide conductive layer.

REFERENCES:
patent: 3900352 (1975-08-01), Porter
patent: 5557137 (1996-09-01), Cohen
Howard, "Limitations and Prospects of a-Si:H TFTs", Journal of the SID, vol. 3, No. 3, 1995, pp. 127-132.
Walter et al., "Nitrogen Plasma Source Ion Implantation of Aluminum", J. Vac. Sci. Technol. B 12(2), Mar./Apr. 1994, pp. 945-950.
Lewis, Sr., "Hawley's Condensed Chemical Dictionary, 12 .sup.th Edition", 1993, p. 303.

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