Alumina abrasive for chemical mechanical polishing

Details Alumina abrasive for chemical mechanical polishing Alumina abrasive for chemical mechanical polishing

2004-10-26

2008-03-18

Tran, Binh X. (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S690000, C438S691000, C438S693000, C252S079100, C252S079200, C216S053000, C216S089000, C423S111000, C423S625000, C051S298000, C051S307000

Reexamination Certificate

active

07344988

ABSTRACT:
Methods of manufacturing alumina abrasive for use in chemical mechanical polishing are described, wherein the abrasive is in a slurry having gamma alumina formed in a low temperature fuming process, water, an acid sufficient to maintain the pH below about 7, wherein the slurry does not settle appreciably in an 8 to 24 hour period. Advantageously, the alumina is wet-milled without the use of wet-milling salt additives.

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