Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-05-22
2007-05-22
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C361S736000, C361S752000, C361S816000, C361S737000, C257S666000, C257S679000
Reexamination Certificate
active
09878302
ABSTRACT:
A semiconductor card is made by a disclosed method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral opening. The connecting segments are motivated downward by pins outside of the card periphery, holding the substrate against a lower level of the mold cavity during molding. Molded wings extending laterally from the card periphery are also formed. Following molding and curing, the casting is removed and the card singulated by excising the wings from the card. The resulting card has smooth edge surfaces and precise dimensions. Separate glob top encapsulation is avoided.
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Jr. Carl Whitehead
Micro)n Technology, Inc.
Mitchell James M.
TraskBritt PC
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