Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2008-10-13
2011-11-01
Hamilton, Cynthia (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S285100, C430S286100, C430S287100, C430S916000, C430S919000, C430S920000, C430S922000, C430S921000, C430S923000, C430S924000, C430S926000, C430S277100, C430S018000, C430S311000, C430S032000, C430S330000, C522S026000, C522S027000, C522S028000, C522S033000, C522S053000, C522S050000, C522S057000, C522S063000, C522S065000, C522S103000, C522S913000
Reexamination Certificate
active
08048613
ABSTRACT:
An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 μm of the film thickness at a wavelength of 350 to 375 nm.
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Arima Masao
Itoh Nobuhito
Kato Kenji
Shibasaki Yoko
Hamilton Cynthia
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Taiyo Ink Mfg. Co., Ltd.
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