Alignment method

Details Alignment method Alignment method

2006-07-11

2006-07-11

Nguyen, Henry Hung (Department: 2851)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S077000

Reexamination Certificate

active

07075621

ABSTRACT:
An alignment method for substrates includes preparing an alignment apparatus having a movement mechanism to move a target substrate in horizontal and vertical directions, a rotation mechanism to rotate the substrate in a horizontal plane, an illumination tool to irradiate the substrate, an image sensor to pick up an substrate image, an edge position sensor to sense the substrate edge positions, and a control computer, transferring the substrate from a previous stage using the moving mechanism, measuring the substrate position using the image sensor which picks up the image on a back surface of the substrate, while irradiating the substrate with the illumination tool from a sidewise direction, calculating positional shifts regarding X, Y, and θ of the mask, using the edge position sensor and control computer, correcting the positional shifts of the mask by the moving and rotation mechanisms, and transferring the substrate to a next stage.

REFERENCES:
patent: 4920385 (1990-04-01), Clarke et al.
patent: 5152055 (1992-10-01), L'Esperance et al.
patent: 5199448 (1993-04-01), Parker
patent: 5559727 (1996-09-01), Deley et al.
patent: 5737441 (1998-04-01), Nishi
patent: 6275748 (2001-08-01), Bacchi et al.
patent: 6360144 (2002-03-01), Bacchi et al.
patent: 6366830 (2002-04-01), Bacchi et al.
patent: 6453214 (2002-09-01), Bacchi et al.
patent: 6577382 (2003-06-01), Kida et al.
patent: 6697145 (2004-02-01), Aoyama
patent: 09-160651 (1997-06-01), None
patent: 11-106044 (1999-04-01), None
patent: 11-150172 (1999-06-01), None
patent: 2000-182561 (2000-06-01), None
patent: 2000-200810 (2000-07-01), None
patent: 2001-253536 (2001-09-01), None

Affiliated with

Also associated with

Rating

Alignment method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Alignment method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alignment method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3571661