Alignment mark configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Reexamination Certificate

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Reexamination Certificate

active

07057299

ABSTRACT:
An alignment mark configuration, wherein the alignment mark is protected from being damaged from the subsequent planarization process, is described. The alignment mark configuration comprises a plurality of recesses and a flat spacing between the recesses on the substrate. If the substrate further comprises a trench structure, the spacing between the trench structure and the alignment mark is at least 5 times the flat spacing between the neighboring recesses of the alignment mark.

REFERENCES:
patent: 5316966 (1994-05-01), Van Der Plas et al.
patent: 5668042 (1997-09-01), Bae
patent: 5733801 (1998-03-01), Gojohbori
patent: 5893744 (1999-04-01), Wang
patent: 5949145 (1999-09-01), Komuro
patent: 6015744 (2000-01-01), Tseng
patent: 6037671 (2000-03-01), Kepler et al.
patent: 6043133 (2000-03-01), Jang et al.
patent: 6100158 (2000-08-01), Lee et al.
patent: 6181018 (2001-01-01), Saino
patent: 6191000 (2001-02-01), Huang et al.
patent: 6215197 (2001-04-01), Iwamatsu
patent: 6285455 (2001-09-01), Shiraishi
patent: 6326309 (2001-12-01), Hatanaka et al.
patent: 6342735 (2002-01-01), Colelli et al.
patent: 6344698 (2002-02-01), Barr et al.
patent: 6391737 (2002-05-01), Ku et al.
patent: 6440816 (2002-08-01), Farrow et al.
patent: 6545336 (2003-04-01), Kobayashi et al.

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