4. Electricity: circuit makers and breakers
  5. Fluid pressure
  6. Diaphragm

Mohd S. Ismail

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Aligned wafer bonding

Metal fusion bonding – Process – Diffusion type
Patent

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Digital pressure switch and method of fabrication

Electricity: circuit makers and breakers – Fluid pressure – Diaphragm
Patent

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Nitrogen based low temperature direct bonding

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Profile ID: LFUS-PAI-P-1527917

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