Advanced low cost high throughput processing platform

Details Advanced low cost high throughput processing platform Advanced low cost high throughput processing platform

2005-04-01

2010-02-09

Lowe, Michael S (Department: 3652)

Material or article handling

Apparatus for moving material between zones having different...

C414S935000, C414S939000

Reexamination Certificate

active

07658586

ABSTRACT:
A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.

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File History for co-pending U.S. Appl. No. 10/919,582, filed Aug. 17, 2004, Publication No. 2006-0045664-A1.
File History for co-pending U.S. Appl. No. 11/622,361, filed Jan. 11, 2007, Publication No. 2007-0175864-A1.
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Notice of Allowance dated Jun. 12, 2009 for co-pending U.S. Appl. No. 11/622,361, filed Jan. 11, 2007.

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