Adhesion promotion in photoresist lamination and processing

Details Adhesion promotion in photoresist lamination and processing Adhesion promotion in photoresist lamination and processing

1986-03-07

1987-09-15

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430324, 430325, 430327, 430329, 430281, G03C 500

Patent

active

046939598

ABSTRACT:
Use of a photoresist is improved due to increased adhesive to a substrate through an additive in the resist of a condensation polymer of formaldehyde, toluene sulfonamide and either a triazine such as melamine or hydantoin.

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patent: 4387157 (1983-06-01), Bronstert et al.
patent: 4442198 (1984-04-01), Tsao et al.
patent: 4528261 (1985-07-01), Hauser

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