Additive for photoresist composition for resist flow process

Details Additive for photoresist composition for resist flow process Additive for photoresist composition for resist flow process

2006-12-19

2006-12-19

Lee, Sin (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S325000, C430S330000, C430S311000, C430S905000, C430S914000, C430S270100

Reexamination Certificate

active

07150961

ABSTRACT:
The present invention provides an additive for a photoresist composition for a resist flow process. A compound of following Formula 1 having low glass transition temperature is added to a photoresist composition containing a polymer which is not suitable for the resist flow process due to its high glass transition temperature, thus improving a flow property of the photoresist composition. As a result, the photoresist composition comprising an additive of Formula 1 can be used for the resist flow process.wherein, A, B, R and R′ are as defined in the specification of the invention.

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Korean Intellectual Property Office Notice of Rejection, corresponding to co-pending Korean Patent Application Serial No. 10-2000-0032984, Korean Intellectual Property Office, dated Dec. 27, 2005, 5 pages.

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