Additive composition, slurry composition including the same,...

Details Additive composition, slurry composition including the same,... Additive composition, slurry composition including the same,...

2007-09-26

2010-12-28

Deo, Duy-Vu N (Department: 1713)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S691000, C438S692000, C438S693000, C252S079100, C252S079400

Reexamination Certificate

active

07858527

ABSTRACT:
An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.

REFERENCES:
patent: 4711919 (1987-12-01), Peppmoller et al.
patent: 4773967 (1988-09-01), Peppmoller et al.
patent: 5938505 (1999-08-01), Morrison et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 6114249 (2000-09-01), Canaperi et al.
patent: 6435944 (2002-08-01), Wang et al.
patent: 6602436 (2003-08-01), Mandigo et al.
patent: 6726534 (2004-04-01), Bogush et al.
patent: 0152087 (1985-02-01), None
patent: 11148538 (2001-10-01), None
patent: 0879852 (2007-09-01), None
patent: 2256644 (1992-12-01), None
patent: 10-106988 (1998-04-01), None
patent: 10-154672 (1998-06-01), None
patent: 10-270401 (1998-10-01), None
patent: 2001-31951 (2001-02-01), None
patent: 2001-35820 (2001-02-01), None
patent: 2001-319900 (2006-11-01), None
patent: 2001-0108048 (2001-12-01), None
patent: 01/14496 (2001-03-01), None

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