Acoustic streaming of condensate during sputtered metal...

Details Acoustic streaming of condensate during sputtered metal... Acoustic streaming of condensate during sputtered metal...

2005-05-24

2005-05-24

VerSteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C427S600000, C427S331000

Reexamination Certificate

active

06896774

ABSTRACT:
Metal may be deposited into trenches, vias, or other wafer openings using a physical vapor deposition chamber under vacuum. Sonic energy may be applied directly to the wafer having the openings to be filled. As a result, pinching off of the openings may be reduced or eliminated.

REFERENCES:
patent: 6554969 (2003-04-01), Chong
patent: 20030196891 (2003-10-01), Azuma et al.
“Physical Cleaning of Submicron Trenches Mixing and Cleaning in Stead Flow Rinse”, Nanomanufacturing Research Institute, Northeastern University.

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