Acetal compound, polymer, resist composition and patterning...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S322000, C430S326000, C430S330000, C430S905000, C430S910000, C526S266000, C549S369000

Reexamination Certificate

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06962767

ABSTRACT:
Acetal compounds in which a 5- or 6-membered ring acetal structure is connected to a norbornene structure through a linker represented by —(CH2)m— in which one hydrogen atom may be substituted with a hydroxyl or acetoxy group, and m is from 1 to 8 are novel. Using the acetal compounds as a monomer, polymers are obtained. A resist composition comprising the polymer as a base resin is sensitive to high-energy radiation and has excellent sensitivity, resolution, and etching resistance.

REFERENCES:
patent: 6136499 (2000-10-01), Goodall et al.
patent: 6476240 (2002-11-01), Sumino
patent: 6515149 (2003-02-01), Watanabe et al.
patent: 6515150 (2003-02-01), Nakashima et al.
patent: 6566038 (2003-05-01), Nishi et al.
patent: 2003/0118933 (2003-06-01), Han et al.
“Engineered Monodisperse Meseporous Materials”, Sandia National Labs, Albuquerqe NM; Saunders et al. Aug. 1997, SAND97-2027.
Heimchen, et. al. Chemical Abstracts, vol. 107, No. 236295, 1987.

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