Accurate parasitic capacitance extraction for ultra large...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000, C716S030000, C324S765010, C438S014000, C257S048000

Reexamination Certificate

active

07818698

ABSTRACT:
A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

REFERENCES:
patent: 5761080 (1998-06-01), DeCamp et al.
patent: 5773317 (1998-06-01), Wu et al.
patent: 5828580 (1998-10-01), Ho
patent: 6084285 (2000-07-01), Shahani et al.
patent: 6088523 (2000-07-01), Nabors et al.
patent: 6185722 (2001-02-01), Darden et al.
patent: 6219631 (2001-04-01), Oh et al.
patent: 6243653 (2001-06-01), Findley
patent: 6438729 (2002-08-01), Ho
patent: 6457163 (2002-09-01), Yang
patent: 6539526 (2003-03-01), Deng
patent: 6665849 (2003-12-01), Meuris et al.
patent: 6728942 (2004-04-01), Lampaert et al.
patent: 6838869 (2005-01-01), Rogers et al.
patent: 6854100 (2005-02-01), Chuang et al.
patent: 6885214 (2005-04-01), Su et al.
patent: 7089516 (2006-08-01), Arora et al.
patent: 7231618 (2007-06-01), Huang et al.
patent: 7263477 (2007-08-01), Chen et al.
patent: 7320116 (2008-01-01), Mukaihira
patent: 7348624 (2008-03-01), Sakaguchi et al.
patent: 2002/0188920 (2002-12-01), Lampaert et al.
patent: 2003/0122123 (2003-07-01), Deng et al.
patent: 2003/0206033 (2003-11-01), Chan et al.
patent: 2004/0078765 (2004-04-01), Cui et al.
patent: 2004/0207412 (2004-10-01), Kunikiyo et al.
patent: 2005/0024077 (2005-02-01), Huang et al.
patent: 2005/0216873 (2005-09-01), Singh et al.
patent: 2005/0240883 (2005-10-01), Huang et al.
patent: 2005/0260776 (2005-11-01), Wang et al.
patent: 2006/0107246 (2006-05-01), Nakamura
patent: 2006/0271888 (2006-11-01), Meuris et al.
patent: 2007/0087719 (2007-04-01), Mandal et al.
patent: 2007/0198967 (2007-08-01), Ren et al.
patent: 2008/0320428 (2008-12-01), Lin
patent: 2009/0002012 (2009-01-01), Doong et al.
patent: 2009/0077507 (2009-03-01), Hou et al.
patent: 2009/0184316 (2009-07-01), Hsu et al.
Dae-Hyung et al., “Measurement and Characterization of Multi-Layered Interconnect Capacitance for Deep Submicron VLSI Technology”, Pr0c. IEEE 1997 Int. Conference on Microelectronic Test Structures, vol. 10, Mar. 1997, pp. 91-94.

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