Ablation patterning of multi-layered structures

Details Ablation patterning of multi-layered structures Ablation patterning of multi-layered structures

1995-03-31

1998-12-01

Vargot, Mathieu D.

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

21912171, 264156, 264409, 4251744, B23K 2600, B32B 3118

Patent

active

058433635

ABSTRACT:
A process for ablation etching through one or more layers of dielectric materials while not etching an underlying conductive material layer comprises selecting parameters whereby the ablation process automatically stops when the conductive material layer is reached, or monitoring the process for end point detection of the desired degree of ablation. Parameters selected are the absorptivity of the dielectric layer versus that of the conductive material layer. End point detection includes monitoring radiant energy reflected from the workpiece or the content of the materials being ablated from the workpiece.

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