3-Dimensional flash memory device and method of fabricating...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

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C438S311000, C438S270000, C438S297000, C257SE21140, C257SE21115, C257SE21121, C257SE21193, C257SE21231, C257SE21267, C257SE21396, C257SE21585, C257SE21646, C257SE21701

Reexamination Certificate

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07662720

ABSTRACT:
In an embodiment, a 3-dimensional flash memory device includes: a gate extending in a vertical direction on a semiconductor substrate; a charge storing layer surrounding the gate; a silicon layer surrounding the charge storing layer; a channel region vertically formed in the silicon layer; and source/drain regions vertically formed on both sides of the channel region in the silicon layer. Integration can be improved by storing data in a 3-dimensional manner; a 2-bit operation can be performed by providing transistors on both sides of the gate.

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