3-D laser patterning process utilizing horizontal and vertical p

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430313, 430315, 430318, 430329, G03F 740

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active

06114097&

ABSTRACT:
A process which vastly improves the 3-D patterning capability of laser pantography (computer controlled laser direct-write patterning). The process uses commercially available electrodeposited photoresist (EDPR) to pattern 3-D surfaces. The EDPR covers the surface of a metal layer conformally, coating the vertical as well as horizontal surfaces. A laser pantograph then patterns the EDPR, which is subsequently developed in a standard, commercially available developer, leaving patterned trench areas in the EDPR. The metal layer thereunder is now exposed in the trench areas and masked in others, and thereafter can be etched to form the desired pattern (subtractive process), or can be plated with metal (additive process), followed by a resist stripping, and removal of the remaining field metal (additive process). This improved laser pantograph process is simpler, faster, move manufacturable, and requires no micro-machining.

REFERENCES:
patent: 4992847 (1991-02-01), Tuckerman
patent: 5017509 (1991-05-01), Tuckerman
patent: 5049421 (1991-09-01), Kosh
patent: 5241450 (1993-08-01), Bernhardt et al.
patent: 5302778 (1994-04-01), Maurinus

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