4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents
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Dirner John P.

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Do Byung T.

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Domadia Ashok

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Dreiza Mahmoud

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Dubelloy Jean-Luc

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Eckenfelder Robert C.

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Ellsworth, Jr. Michael J

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Ellsworth, Jr. Michael J.

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Emery Richard D.

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ENI Div. of Astec America, Inc.

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Eslamy Mohammad

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Esmailpour Mohsen

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Eupec Europaische Gesellschaft fur Leistungshalbleiter GmbH

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Ewer Peter Richard

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Fagan, Jr. Thomas J

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Filreis Jon

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Foster Donald Craig

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Freescale Smeiconductor, Inc.

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Freund Joseph Micheal

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Fujieda Nobuo

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