4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents
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Tominaga Kaoru

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Topfer Manfred

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Tseng Wen-Tsung

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Tsuchiya Jyunichi

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Tunnell Timothy B.

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Tustaniwskyi Jerry Ihor

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Tweet Kerry

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Ueno Seiji

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Ukai Yoshimitsu

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Umezawa Yoshiaki

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United Test & Assembly Center Ltd.

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Universite D'Angers

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Vaccaro Brian T.

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Vadakkanmaruveedu Unnikrishnan

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Valenti Gregory P.

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Van Der Meulen Rintje

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Van Eck Andrea Henricus Maria

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Van Sprang Hans

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Vaughn Wayne P.

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Vaze Anirudh N.

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