4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material
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McCoy Carol G.

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McCoy Carol G.

Representative

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McCullough John C.

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McLellen Neil Robert

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Menzies Brad

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Mhaisalkar Subodh

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Microassembly Technologies, Inc.

Corporate Assignee

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Microsemi Corporation

Corporate Assignee

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Mieczowski Van

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Mihara Kenjiro

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Mihara Kenjirou

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Mihelcic Stan

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Miitsu Takeshi

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Mirgorodski Iouri

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Miura Taiki

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Miura Yoichi

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Miyauchi Masahiko

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Mizuno Takahito

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Moors Petrus M. A. W.

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Morozumi Akira

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