4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material
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D
E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9 ! " $ ' ( ) * , - / : < = > ? @ [ \ ] ^ ` { | } ~ €

Dai Xiang

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Dai Nippon Printingco., Ltd.

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Dalrymple Thomas W.

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Damphousse Simon J.

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Davidson Robert Paul

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Day Chiang-Han

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Dayton Kristopher E.

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Dean Nancy

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DeLage Sylvain

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Delaplane Niel C.

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Di Caprio Vincent

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Diep Jacquana

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Djekic Ognjen

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Do Hoa Lap

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Doan Trung Tri

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Dover Capital Formation Group

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DTNR Ltd.

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Dunbar Mark R.

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Dunne Rajiv Carl

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