4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Takeshi Miitsu

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Apparatus and a method for removing solder from an object

Metal fusion bonding – Process of disassembling bonded surfaces – per se
Reexamination Certificate

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Method for removing solder bumps from LSI

Metal working – Method of mechanical manufacture – Disassembling
Reexamination Certificate

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Method for removing solder bumps from LSI

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method for removing solder bumps from LSI

Metal working – Method of mechanical manufacture – Disassembling
Reexamination Certificate

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Multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2103620

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