4. Metal fusion bonding
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Captured-cell solder printing and reflow methods and apparatuses

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Patent

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Circuit board component retention

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
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Component-mounted circuit board production system

Metal fusion bonding – With control means responsive to sensed condition
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Conductive ball arraying apparatus

Metal fusion bonding – With control means responsive to sensed condition
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