Metal fusion bonding – With control means responsive to sensed condition
Patent
1994-06-16
1997-03-04
Ramsey, Kenneth J.
Metal fusion bonding
With control means responsive to sensed condition
228 9, 228102, B23K 300
Patent
active
056070977
ABSTRACT:
A production system for mounting components on circuit boards includes a solder printing unit having a solder printing device for printing solder onto lands of a circuit board and a solder printing inspecting device for inspecting a printing state the solder, a component mounting unit having a component mounting device for mounting a component to a predetermined position of the printed solder on the circuit board and a component mounting inspecting device for inspecting a mounting state of the component, and a soldering unit having a soldering device for melting and hardening the printed solder and a soldering inspecting device for inspecting a soldering state of the soldering. The system further includes a data memory, a first information data input device for inputting into the data memory first data related to each of the devices in the printing unit, component mounting unit, and soldering unit, and a second information data input device for inputting into the data memory second data related results of countermeasures executed based on the inputted first data of the three inspecting devices. The system still further includes a correlation analyzing part which combines corresponding items of the first and second data stored in the data memory and analyzes a frequency of each item, thereby generating rules which to predict or estimate a result from a cause, a cause from a result, and a result from a maintenance work among the first data, second data, and maintenance works.
REFERENCES:
patent: 5145099 (1992-09-01), Wood et al.
Fujiwara Hiroaki
Kanematsu Koichi
Okada Yasuhiro
Sato Ken'ichi
Matsushita Electric - Industrial Co., Ltd.
Ramsey Kenneth J.
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