4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With means for controlling lead tension
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Electronic package having improved wire bonding capability

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Patent

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Electronic substrate multiple location conductor attachment tech

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Patent

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