Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Patent
1991-07-26
1993-08-03
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With means for controlling lead tension
257668, 257673, 257735, 257738, 257773, 257786, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
052332217
ABSTRACT:
A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.
REFERENCES:
patent: 4145707 (1979-03-01), Sadamasa et al.
patent: 4166312 (1979-09-01), Harigane et al.
patent: 4223337 (1980-09-01), Kojima et al.
patent: 4306246 (1981-12-01), Davies et al.
patent: 4361173 (1982-11-01), Storimans
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4538210 (1985-08-01), Schaller
patent: 4573501 (1986-03-01), Furuya
patent: 4814855 (1989-03-01), Hodgson et al.
patent: 4887760 (1989-12-01), Yoshino et al.
patent: 4912547 (1990-03-01), Bilowith et al.
patent: 4949158 (1990-08-01), Ueda
patent: 4972253 (1990-11-01), Palino et al.
patent: 4996582 (1991-02-01), Nagahama
patent: 5016080 (1991-05-01), Giannella
patent: 5023700 (1991-06-01), Takeuchi et al.
patent: 5028983 (1991-07-01), Bickford et al.
patent: 5034792 (1991-07-01), Kimura et al.
patent: 5070387 (1991-12-01), Van Gorkum
Microelectronics Packaging Handbook edited by Rao R. Tummala and Eugene J. Rymaszewski, published by Van Nostrand, (1989), pp. 409-431.
IBM Technical Disclosure Bulletin vol. 32, No. 11, Apr. 1990, pp. 246 and 247 "Quadtab: A Technique for the Simplification and Enhancement of Tab" by Honeycutt et al.
IBM Technical Disclosure Bulletin vol. 14, No. 8, Jan. 1972, p. 2435 "Connection of Discrete Leads to Packaged Circuits" by W. E. Dougherty.
Bregman Mark F.
Horton Raymond R.
Lanzetta Alphonso P.
Noyan Ismail C.
Palmer Michael J.
International Business Machines - Corporation
James Andrew J.
Morris Daniel P.
Ngo Ngan Van
Riddles Alvin J.
LandOfFree
Electronic substrate multiple location conductor attachment tech does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic substrate multiple location conductor attachment tech, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic substrate multiple location conductor attachment tech will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2273074