Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Patent
1995-05-25
1996-04-09
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With means for controlling lead tension
257669, 257668, 257698, H01L 2306, H01L 2310
Patent
active
055064469
ABSTRACT:
There is provided a base for an electronic package. The base includes a peripheral portion for a polymer adhesive and a central portion for one or more semiconductor devices. A lead support is adjacent the substrate and located between the peripheral portion and the central portion. When a polymer adhesive bonds a leadframe to the package base, the lead support prevents deflection of the inner lead tips.
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Brathwaite George A.
Bui Doanh D.
Hoffman Paul R.
Mahulikar Deepak
Limanek Robert P.
Olin Corporation
Rosenblatt Gregory S.
Williams Alexander Oscar
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