4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With dam or vent for encapsulant
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Resin sealed semiconductor device including a die pad uniformly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Resin-molded device and manufacturing apparatus thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Resin-packaged semiconductor device with flow prevention dimples

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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