Resin-packaged semiconductor device with flow prevention dimples

Details Resin-packaged semiconductor device with flow prevention dimples Resin-packaged semiconductor device with flow prevention dimples

1994-01-05

1995-08-08

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257706, 257717, 257730, 257796, H01L 2328, H01L 2348

Patent

active

054401690

ABSTRACT:
A resin-packaged semiconductor device having a semiconductor element mounted on a first surface of a mounting pad. The mounting pad has an edge molded in a frame-shaped portion of a molding material. A second surface of the mounting pad has a central portion that is not included in the edge of the mounting pad and that is not covered with the molding material, the central portion of the second surface being exposed at the outside of the device. The thickness of the molding material in the frame-shaped portion and on the second surface of the mounting pad can be readily reduced to reduce the thickness of the device. Since the molding material does not cover the entire second surface, molding characteristics as well as heat radiation characteristics are improved.

REFERENCES:
patent: 4777520 (1988-10-01), Nambu et al.
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5214846 (1993-06-01), Asami et al.
patent: 5216283 (1993-06-01), Lin

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