4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With housing mount
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Dicing tape and die ejection method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate

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Die assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate

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Die attachment and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate

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Direct contact die attach

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Patent

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