4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Smart card package

Teru Hirata

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active

IC card including a substrate having improved strength and heat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Method of making resin encapsulated semiconductor device with bu

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
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Profile ID: LFUS-PAI-P-995581

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