IC card including a substrate having improved strength and heat

Details IC card including a substrate having improved strength and heat IC card including a substrate having improved strength and heat

1995-03-22

1996-05-28

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257701, H01L 2302, H01L 23053, H01L 2312

Patent

active

055214339

ABSTRACT:
An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.

REFERENCES:
patent: 4532419 (1985-07-01), Takeda
patent: 4910582 (1990-03-01), Miyamoto et al.
patent: 4962415 (1990-10-01), Yamamoto

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