Method of making resin encapsulated semiconductor device with bu

Details Method of making resin encapsulated semiconductor device with bu Method of making resin encapsulated semiconductor device with bu

1995-05-17

1998-06-16

Fourson, George

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438614, 26427217, H01L 2156

Patent

active

057669724

ABSTRACT:
A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of a cavity between upper and lower dies is smaller than the height of the semiconductor chip including bump electrodes. During a molding process, the bump electrodes contact the upper die or a dam surrounding the bump electrodes so that no thin burrs are produced on the surfaces of the bump electrodes in the molding process.

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