Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1998-03-30
1999-09-21
Brown, Peter Toby
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438305, 438307, 438558, 438649, 438651, 438664, 438683, H01L 218238
Patent
active
059565845
ABSTRACT:
The present invention includes forming gate structures having a nitride cap on the substrate. An ion implantation is used to dope ions into the substrate to form the lightly doped drain (LDD) structures. An oxide layer is formed on the gate structures. Subsequently, the oxide layer is etched back to form oxide spacers on the side walls of the gate structures. Next, an ion implantation with a high dose is carried out to dope nitrogen ions into the oxide spacers, the cap silicon nitride and the silicon substrate. The cap silicon nitride layer is then removed. Then, a refractory or noble metal layer is sputtered on the substrate, nitride doped oxide spacers and the gates. A first step thermal process is performed to form SALICIDE and polycide. Next, an ion implantation is utilized to dope ions into the SALICIDE and polycide films. A second step thermal process is employed to form shallow source and drain junction.
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Brown Peter Toby
Pham Long
Texas Instruments - Acer Incorporated
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