Simple method of fabricating ferroelectric capacitors

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438 3, 438393, 438396, H01L 2100, H01L 218242, H01L 2120

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active

058077740

ABSTRACT:
A ferroelectric capacitor device and method of manufacture. A substrate supports a bottom electrode structure, with an adhesion/diffusion barrier layer sandwiched therebetween. The electrode layer includes a metal or metal alloy and an oxide of the metal or alloy. The adhesion/diffusion barrier layer is a similar oxide. Ferroelectric material is sandwiched between a top electrode. The top layer includes a metal or metal alloy and an oxide of the same; the metal or metal alloy may be the same as the bottom electrode but need not be. The metal and metal oxide electrodes may be deposited by known deposition techniques, or the metal may be deposited and the oxide formed by annealing in oxygen ambient environment.

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