Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-07-19
1994-03-29
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156664, 252 793, H01L 2100
Patent
active
052981177
ABSTRACT:
The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper chloride, and an additional chloride salt. The etching medium is also particularly useful for bilayer metal constructions such as the copper/titanium structure found in many multichip modules.
REFERENCES:
patent: 4220706 (1980-09-01), Spak
patent: 4345969 (1982-08-01), James et al.
G. Messner et al. Thin Film Multichip Modules, International Society for Hybrid Microelectronics, Reston, Va., 1992.
R. Clark, Handbook of Printed Circuits, Van Nostrand Reinhold, N.Y., 1985.
Hanson Karrie J.
Miller Barry
Sapjeta Barbara J.
Shah Akshay V.
Takahashi Ken M.
AT&T Bell Laboratories
Hearn Brian E.
Holtzman Laura M.
Schneider Bruce S.
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