4. Etching a substrate: processes
  5. Nongaseous phase etching of substrate
  6. Substrate is multilayered

Barbara J. Sapjeta

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Etching of copper-containing devices

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Etching of copper-containing devices

Etching a substrate: processes – Nongaseous phase etching of substrate – Substrate is multilayered
Patent

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Process for etching titanium at a controllable rate

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-575047

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